Try to find the uppermost metal layer where the operation
can be carried out.

AVOID operations near active components or capacitors if possible.

Extra two devices is required for optimising process parameters.
 
 

Here is shown a good policy how to prepare the necessary data for repairs. Using this format ensures that the work can be carried out as fast and accurately as possible.

REQUIRED:

1. The coordinates of the inner bond pad corners/other TOP METAL locations in corners (at least 3 points)

2. The cut coordinates mentioned as  (C1, C2, ...)

3. The connection point coordinates (beginning and end) for the new straps (S1A, S1B, S2A, S2B, ...)

4. The metal layer for the operation 

5. The colour codes for different metal layers

6. The name for the operation file

7. The package type (or the dimensions if the chip is on board, max supported dimension is 3")

A good example how to prepare the coordinate file is shown below.
 
 

Graphics files format should be TIFF, BMP, JPEG. Send them by email to the repair personnel.
 
 

Quote is given based on the information delivered by the customer. The quote and estimated delivery time is returned to the customer by email.

The quote is based on the following facts:

1. The number of the chips.
2. The number of the cuts and the width of them.
3. Is there need for package decapsulation?
4. The number of the rewirings.
5. The length of the rewirings.
6. Is there need for copper deposition?