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LPS2000 - Copper LCVD Unit
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APPLICATIONS

Mixed analogue/digital IC repair

Integrated circuit failure analysis

Laser drilling of vias into various electronics materials (polyimides, ceramics etc.)

Deposition of bonding and probing pads directly to IC's silicon surface

Consultation services for microelectronics and microelectronics

Laser micromachining

LabView programming services

Production tester design


The LPS 2000 copper LCVD system is our novel IC modification device. The design and functionality of the system is based on years of scientific research and technical development. LPS 2000 is an effective laser processing tool for direct IC rewiring depositions and signal line cuttings. The operation of the device relies on an advanced laser technology integrated with navigational accessories, optical microscopy imaging tools and process gas delivery systems. These features offer the unique benefits to be utilised from the semiconductor research to the practical IC modification work.



The LPS 2000 enables fast modification of ICs in the course of failure analysis and circuit repair. The required new rewiring depositions can be carried out by the laser chemical vapor deposition (LCVD) which is absolutely the fastest way to rewire your chips.

During the LPS 2000 process the heat of the laser beam reduces the copper precursor gas (CupraSelectTM) to metallic copper on the surface of the IC passivation layer. This allows direct-writing of new conductor lines by scanning a computer controlled laser beam over the substrate surface. In this way it is possible to lay down complex set of new wirings on a processed IC, as it is often required for carrying out the electrical measurement in the case of prototype IC malfunction.

The LaserProbe System allows the conductor line to be cut with a focused laser pulse which evaporates the metal and disconnects the electrical path. Sometimes it is sufficient only to cut the conductor line, but an ability to fabricate new rewiring depositions is often necessary as well for efficient IC repair. This enables fast modification of ICs in the course of failure analysis and circuit repair. The required new rewiring depositions can be carried out by laser chemical vapor deposition (LCVD) or focused ion beam (FIB) method.


fig. ultra low resistivity copper rewiring combined with FIB-modification



We have delivered LPS2000 system (including full gas cabinet process control) e.g. for Nokia Corporation.
Very low resistivity (~2.7uohmcm) rewirings with very high growth rate with no discharge damages.
Optical imaging (assists FIB navigation to the buried layers).
Laser marking of the buried repair locations (extremely effective tool for helping FIB navigation).
Cutting wide lines in seconds without any IC charging side effects (rather than in tens of minutes as compared to FIB).

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