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IC
modification services
Fast-turnaround ASIC prototype series
have to be brought onto the market quickly. Unfortunately, it is often
noticed that, despite rigorous simulations, design flaws appear in
these circuits, either because of a design fault or because of some
processing error or deviation (mask error, metallurgic deposition
failure etc.). These flaws can usually only be corrected by redesigning
the layout and putting the IC through the semiconductor fabrication
process again, which is costly and time-consuming.
Malfunctions observed in the prototype ICs are typically precluding the
device design testing before launching the final production. Being a
fast method the LaserProbe System helps the designers to overcome the
difficulties at the prototyping stage.
We also provide a full service of decapsulation of IC packages.
Unique low
resistance copper rewirings (LPS 2000)
Various techniques have been developed to carry out integrated circuit
repairs during IC prototyping. Focused ion beam etching and deposition
is, for the time being, the most powerful and versatile tool for
multilevel IC modification and failure analysis but a long distance
conductur line deposition with an acceptable electrical resistance is
very time consuming and costly. Laser chemical vapor deposited copper
rewirings (LCVD) have extremely low bulk resistivity (2.7uohmcm) with
high growth rate. These rewired signal lines and their features offer
new solutions to the IC modifications.
In some cases, it is possible to modificate the circuitry so that the
probing of the IC can be done using external unused pins of the case.
This is performed using a pad deposition (100x100mm^2) and normal
rewiring procedure. A Cu pad thickness of approximately 1 um is
required for the Au wedge bonding. Typically, utilisation of spare pins
of the case helps and simplifies the functional testing and probing of
the IC's malfunction. Figure below shows a malfunction probing
performed on a
SiO2 passivated IC.
LPS2000 system utilises the developed direct write of polysilicon (1986-1989) and
nickel (1994-1995) processes.
LaserProbe utilises also Focused Ion Beam (FIB) technology for ASIC
modification cases and sample analysis and preparation. By combining
these two techniques (LCVD of LPS2000 and FIB) LaserProbe meets the
most challenging modification requirements for both analogue and
digital circuits.
How to order
a modification work?
Please find instructions from here...
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