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Laser Probe LP Ltd. was established
in 1999
and is fully privately owned. LaserProbe, a spin-off company, was the
result of nearly twenty years intensive research on the materials laser
processing in the University of Oulu, Microelectronics and Material
Physics Laboratories.
One of our core business is ASIC (application specific integrated circuit)
modification services. Also, we
are focusing on micromechanical services e.g. micromachining
of
small devices and micro hole drilling (medical ampoulles etc.).
We have developed and fully CE-certified the LPS2000 copper
deposition system. This device is used to create ultra low resistivity
rewirings directly on top of IC. Being a fast modification device the
LPS 2000 series helps the designer to overcome the difficulties at the
ASIC prototyping stage.
The LaserProbe System, which provides the fabrication of insulation
cuttings, contact openings and direct writing of Cu rewires, was
developed for the modification of prototype ASICs. This service has
been available for ASIC designers and semiconductor plants since 1995.
We also provide decapsulation of IC packages.
In addition, the LPS 2000 series is capable of various kind of micromachining
applications like trimming, drilling and cutting of metals, ceramics
and plastics and we have provided these services for different
industrial fields (e.g. electronics, medicine, food industry).
We have delivered LPS2000 system (including full gas cabinet process
control) e.g. for Nokia Corporation.
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