|
|
 |
 |
 |
The Laserprobe LP Ltd. is a company
which provides services for microelectronics industry e.g. IC
modification and analysis services.
The Laserprobe company is also capable
of various kind of micromachining applications as trimming, drilling
and cutting of metals, ceramics and plastics. We have our own laser
cutting and micromachining setups which ensures fast and reliable
services.
During many years, we have provided our solutions and expertise
for
companies like Nokia, Intel,
SonyEricsson and Motorola. We have
provided
our services also for dozens of smaller companies from ASIC
design houses to medical companies. So, whether your company is small
or
large - we will pay our closest attention for your needs.
Through our continuous research work, we are
developing procedures for meeting the requirements of the semiconductor
processes and the needs of the all kinds of micromachining
applications. |
|
 |
|
 |
| Fast-turnaround
ASIC prototype series have to be brought onto the market quickly.
Unfortunately, it is often noticed that, despite rigorous simulations,
design flaws appear in these circuits, either because of a design fault
or because of some processing error or deviation (mask
error,metallurgic deposition failure etc.). These flaws can usually
only be corrected by redesigning the layout and putting the IC through
the semiconductor fabrication process again, which is costly and
time-consuming. |
|
| The
LaserProbe System allows the conductor line to be cut with a focused
laser pulse which evaporates the metal and disconnects the electrical
path. Sometimes it is sufficient only to cut the conductor line, but an
ability to fabricate new rewiring depositions is often necessary as
well for efficient IC repair. This enables fast modification of ICs in
the course of failure analysis and circuit repair. The required new
rewiring depositions can be carried out by laser chemical vapor
deposition (LCVD) or focused ion beam (FIB) method. |
|
| LaserProbe
LP Ltd. also provides high quality laser micromachining services.
Drilling and micromachining resolution can be as fine as a couple of
micrometres (submicron accuracy for FIB micromachining), depending on
the material to be processed. |
|
|
|
|
|
